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國立成功大學 |
2023 |
A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force
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Wang, C.-Y.;Chiu, T.-C.;Yin, W.-J.;Chen, D.-L.;Chen, T.-Y.;Kao, C.-L. |
國立成功大學 |
2022 |
Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect
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Yang, C.-M.;Chiu, T.-C.;Yin, W.-J.;Chen, D.-L.;Kao, C.-L.;Tarng, D. |
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
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